- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 153/00 - Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
Patent holdings for IPC class C09J 153/00
Total number of patents in this class: 527
10-year publication summary
56
|
65
|
52
|
51
|
32
|
51
|
29
|
29
|
18
|
5
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Kuraray Co., Ltd. | 3392 |
46 |
Henkel AG & Co. KGaA | 10129 |
27 |
3m Innovative Properties Company | 18406 |
26 |
Avery Dennison Corporation | 1291 |
26 |
LG Chem, Ltd. | 17205 |
23 |
Tesa SE | 1011 |
23 |
Nitto Denko Corporation | 7879 |
21 |
Dow Global Technologies LLC | 10147 |
19 |
Bostik, Inc. | 221 |
12 |
Arkema France | 3790 |
11 |
DIC Corporation | 3597 |
11 |
Toagosei Co., Ltd. | 894 |
11 |
Evonik Röhm GmbH | 452 |
10 |
Iowa State University Research Foundation, Inc. | 685 |
10 |
H.B. Fuller Company | 370 |
9 |
Dai Nippon Printing Co., Ltd. | 3891 |
7 |
Sekisui Fuller Company, Ltd. | 52 |
7 |
BASF SE | 19740 |
6 |
Fujikura Kasei Co., Ltd. | 92 |
6 |
Sekisui Chemical Co., Ltd. | 3159 |
6 |
Other owners | 210 |